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With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, together with the increasing demands upon functionality and reliability, thermal management becomes a more important element of product design. The optimum thermal design can greatly shorten the development cycle and reduce the cost. Thermal design for products can adopt active cooling technology such as conduction, radiation and natural convection.
Thermal interface, conductive adhesive tapes, elastomeric insulators, gap fillers, conductive compounds and phase change materials are the raw materials that we can convert to your final part configuration.
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• Thermflow®
• Thermattach®
• Therm-A-Gap™
• Therm-A-Form™
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• Cho-therm®
• Heat Spreaders
• Thermal Grease |
Request more information about Thermal Management from Florida Seal & Rubber
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